SMT Testing


Let MindShare Bring SMT to Life for You

As the trend toward increased PCB complexity continues, there is a growing need to address testing issues at increasingly earlier stages of the design process. With high-density boards comes the challenge of 1GHZ device speeds and reduced physical access for testing, fault diagnosis and repair. Manufacturing high-quality reliable products requires concentrated effort in two closely related areas:

  • Maintaining tight control of manufacturing process to achieve high first time yields
  • Developing an overall test strategy that provides both early fault detection and feedback of failure data to identify root causes of product defects

MindShare Courses On SMT Testing:

Course Name

Virtual Classroom

SMT Testing
3 days

All of MindShare's classroom and virtual classroom courses can be customized to fit the needs of your group.

SMT Testing Course Info

You Will Learn:

  • How PC board design choices affect test strategy implementation
  • How to reduce overall testing costs
  • Causes of manufacturing defects in SMT assemblies

Course Length: 3 days

Who Should Attend?

  • Electrical Design and PCB Layout Engineers
  • Process and Manufacturing Engineers
  • Test Engineers
  • Quality Control/Quality Assurance Engineers

Course Outline:

  • Board-level guides
  • Routing Board Layout Design Issues
  • Bareboard Test Issues
  • In-Circuit Issues
  • Board Contamination
  • Vision
  • Flying Probe (FP)
  • IEEE 1149.1 Boundary SCAN
  • Test Strategy and Rapid Prototypes

Recommended Prerequisites:

A fundamental understanding of electrical testing of today's PCBs at the bare-board, production line and functional test levels.

Supplied Materials:

Textbook: "Testing Today's High-Density High-Speed PCBs," by Robert J. Hanson. Also, a variety of boards will be displayed to illustrate concerns of testing bare-boards. Videos will be presented showing methods of performing clam shell and flying probe bare-board test. A variety of populated PCBs and videos will be used to reflect the concerns of testing PCBs with today's high-density requirements.